LrCut-P50 Laser Cutting System Available
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Lyric Automation
China
Condition: New
Type: Assembly Equipment
Status: Ready-to-Ship
Ships From: Huizhou, China
Product Description
Advanced Solar Cell Wafer Laser Splitting System designed for high-precision sectioning of silicon wafers for PERC, HIT, Topcon, and IBC solar cell production applications.
Key Features
- Dual-sided groove processing mechanism with precise 1.5mm length cuts at half wafer thickness
- High-throughput production capacity of 4,200 pieces per hour, exceeding the 3,600/h industry standard
- Superior fragmentation control with rates ≤0.04% (0.3‰), minimizing material loss
- Exceptional positioning accuracy of ≤0.08mm for consistent, repeatable results
- Maintains ≥85% strength integrity in processed wafers compared to unprocessed wafers
- Compatible with multiple wafer dimensions including 182mm×210mm and all formats up to 210×210mm
- Achieves production yield rates of ≥99.9% through optimized laser heat effect management
Additional Documentation (NDA Required)
- Detailed Technical Specifications
Key Technical Specifications
| Production Capacity | Max 4,200 pieces/hour | |
| Fragmentation Rate | ≤0.04% | |
| Processing Yield | ≥99.9% | |
| Positioning Accuracy | ≤0.08mm | |
| Compatible Wafer Width | 182 - 210mm | |
| Compatible Wafer Size | ≤210 × 210mm | |
| Groove Depth | 50% of wafer thickness | |
| Groove Length | 1.5mm | |
| Post-Split Strength Retention | ≥85% of original |
Compatibility and Standards
- Electrical Certification: GB. Optional conversion of this equipment to UL/CE standards - contact Diagon for details
- Control Systems: Standard Omron series. Optional control system migration (Siemens, Rockwell/Allen-Bradley, others) to match your existing infrastructure - contact Diagon for compatibility assessment
Serial Number: 43-90542