Product Description

Advanced Solar Cell Wafer Laser Splitting System designed for high-precision sectioning of silicon wafers for PERC, HIT, Topcon, and IBC solar cell production applications.

Key Features:

• Dual-sided groove processing mechanism with precise 1.5mm length cuts at half wafer thickness
• High-throughput production capacity of 4,200 pieces per hour, exceeding the 3,600/h industry standard
• Superior fragmentation control with rates ≤0.04% (0.3‰), minimizing material loss
• Exceptional positioning accuracy of ≤0.08mm for consistent, repeatable results
• Maintains ≥85% strength integrity in processed wafers compared to unprocessed wafers
• Compatible with multiple wafer dimensions including 182mm×210mm and all formats up to 210×210mm
• Achieves production yield rates of ≥99.9% through optimized laser heat effect management

Additional documentation available upon signing NDA

• Detailed Technical Specifications

Key Technical Specs:

• Production Capacity: Max 4200pieces/hour
• Fragmentation Rate: ≤ 0.04 %
• Processing Yield: ≥ 99.9%
• Positioning Accuracy: ≤ 0.08mm
• Compatible Wafer Width: 182 - 210mm
• Compatible Wafer Size: ≤ 210 × 210mm
• Groove Depth: 50% of wafer thickness
• Groove Length: 1.5mm
• Post-Split Strength Retention: ≥ 85% of original

Serial Number - 43-90542