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KS-S300-1DBL Laser Debonding Tool
King Semi
Categories:
Die Bonding & Chip Attachment Systems
Model Overview
Supports throughput 12 WPH. Supports factory automation. Offers optional laser path systems with different wavelengths according to customer needs. Uses a flattop laser beam for uniform laser energy. Provides accurate control of liquid, temperature, pressure and flow of chemical. Includes a chemic...
Technical Specifications
Throughput12 WPH
Category PathAssembly & Packaging > Component Placement > Die Bonding & Chip Attachment Systems
Manufacturer ID8735aaa8-7831-4100-b918-626fb1175dad
Chemical Controlaccurate control of liquid, temperature, pressure and flow of chemical
Laser Beam Profileflattop
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