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Palomar Technologies, Inc.6532HP Die Bonder

6532HP Die Bonder

Palomar Technologies, Inc.

Categories:
Die Bonding & Chip Attachment Systems
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Model Overview

6532HP Die Bonder is an industrial automated die-attach system designed for precision placement and attachment of semiconductor dice and microelectronic components onto substrates, leadframes or carrier assemblies. The system centers on automated pick-and-place die handling with alignment capability...

Technical Specifications

Alignmentoptical alignment/vision guidance
System Typedie-attach system
Category PathAssembly & Packaging > Component Placement > Die Bonding & Chip Attachment Systems
Bonding Modulededicated bonding module
Integration IOintegration-friendly I/O for factory automation and peripheral equipment
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