PP Series Precision Jigs

Overview

Logitech PP Series jigs include digital dial gauges with optional Bluetooth and a Bluetooth-enabled micrometer that can automatically shut off the system once a preset removal amount is reached. They provide real-time data feedback with export capability and are designed for use with systems like the LP70 and PM6. PP jigs support vacuum and mechanical mounting and can be customised for thicker or longer samples, with extended-leg options available on PP5 and PP6 models and support for up to 7kg additional load. Accurate sample alignment is assisted by integrated angular adjustment plates (±3°) and accessories such as the LG2 Autocollimator. Model specifications: - PP5 — Outside Diameter of Jig: 127mm; Outside Diameter of Chuckface: 83mm; Total Thickness Variation (TTV) of Sample Post Process: +/- 1.5um; Range of Jig Loads Applied to Samples: 0.2 - 2.8kg; Angular Adjustment Range: +/- 1.5 °; Total Jig Mass (Jig Only): 5.4kgk. - PP6 — Outside Diameter of Jig: 152mm; Outside Diameter of Chuckface: 112mm; Total Thickness Variation (TTV) of Sample Post Process: +/- 2um; Range of Jig Loads Applied to Samples: 0.2 - 4.8kg; Angular Adjustment Range: +/- 1.5 °; Total Jig Mass (Jig Only): 8.4kg. - PP8 — Outside Diameter of Jig: 210mm; Outside Diameter of Chuckface: 160mm; Total Thickness Variation (TTV) of Sample Post Process: +/- 3um; Range of Jig Loads Applied to Samples: 0.2 - 6.7kg; Angular Adjustment Range: +/- 1.5 °; Total Jig Mass (Jig Only): 14.4kg. - PP9 — Outside Diameter of Jig: 260/270mm; Outside Diameter of Chuckface: 210mm; Total Thickness Variation (TTV) of Sample Post Process: +/- 4um; Range of Jig Loads Applied to Samples: 0.2 - 9.5kg; Angular Adjustment Range: N/A; Total Jig Mass (Jig Only): 19.9kg. Semiconductors: Logitech describes complete solutions for precise thinning of III-V, IR, and similar materials, supporting stages such as wafer slicing, surface preparation, and thinning for devices including transistors, ICs, and IR detectors. Optoelectronics and Optics: The PP Series is presented for preparing materials like silicon and lithium niobate for applications such as DWDM, optical switches, and signal processors, and for cutting, lapping, and polishing optical materials for telecom uses including IR, waveguides, and fiber optics. Geological Sciences and CMP: The product is listed for high-quality geological thin section production for rocks, soils, coal, concrete, and fluid inclusions, and for CMP-related Tribology Science and Research including coefficient of friction monitoring (CoF) and adaptation to MEMS applications such as polysilicon surface micromachining, Opto-MEMS and Bio-MEMS packaging, assembly and fabrication. Other Applications noted include additional cutting, lapping, and polishing tasks referenced by Logitech.