Bonding Tester PTR1102

Overview

Bonding Tester PTR1102 is a bonding tester that can perform measurements from pull test to die shear test with a single unit. It measures tensile (pull) strength and ball/bond shear strength of the gold wire used in wire bonding in semiconductor device manufacturing, and the instrument provides load detection accuracy and fine positioning accuracy. Measurement load ranges are: pull/push/peel: 20kgMAX, shear test: 100kgMAX, with a measurement accuracy of ±0.2%FS. Measurement speed ranges are 0.001~5mm/s for pull/push/peel and 0.001~10mm/s for shear. Travel ranges are X: ±150mm, Y: ±150mm, and Z: MAX70mm. Observation orientation can be up/down 45 degrees and left/right ±90 degrees adjustable. The unit supports joystick control of four axes (X, Y, Z, θ), allows alignment→measurement→data transfer with a mounted microscope as a single sequence, and the microscope can be rotated to observe the measurement site from ±90 degrees. Measurement can be performed without connecting a PC using an optional printer (startup time about 3 seconds). Holders for various work shapes are designed to customer requirements, shear-test orientation is performed automatically toward the shear tool direction, and during shear tests Y-axis load output and simultaneous Z-axis load output are possible (requires PC connection). The PTR1102 is used to measure pull, push, peel and shear strengths related to wire bonding and die bonding in semiconductor device manufacturing, covering tests from pull test to die shear test with one unit. Exchangeable sensors allow the instrument to maintain precision in low-load measurement ranges while responding to high-load measurement ranges. Microscope-mounted alignment followed by measurement and data transfer in one sequence, joystick operation of X/Y/Z/θ axes, rotateable microscope observation (±90 degrees), and optional printer-only measurement (startup ~3 seconds) are provided to support the described measurement activities.