XTRAIA XD-3200

Overview

The XTRAIA XD-3200 is an in-line HRXRD and XRR x-ray metrology tool for non-destructive analysis of single- and multi-layer films on blanket 300 mm and 200 mm wafers, designed for high-throughput measurements in high-volume manufacturing. Measurement results include film thickness, density, and roughness by X-ray reflectometry (XRR), and epitaxial film thickness, composition, strain, lattice relaxation, and crystal structure quality by high-resolution XRD (HRXRD) using rocking curve (RC) and reciprocal space mapping (RSM). A 1/4-circle chi cradle enables twist/tilt-angle measurements and crystal orientation (film texture) measurements. Hardware features include a 9 kW Cu rotating anode X-ray source or a 2.2 kW Cu sealed tube option with line focus and mirror and/or 2/4 bounce crystal optics, a 2-dimensional detector (HyPix-3000) with ultrahigh dynamic range and high sensitivity, a highly accurate goniometer and stage, and X-ray optics supporting up to 2 monochromators Ge (400)x2,Ge(220)x2,Ge(220)x4. Physical dimensions are 1656(W) x 3689(D) x 2289(H) mm, and the system supports factory automation standards GEM300 and E84/OHT for high-volume manufacturing. The XTRAIA XD-3200 is intended for in-line metrology and process monitoring in high-volume manufacturing on blanket 300 mm and 200 mm wafers. Explicitly listed application areas include Transistor (SiGe), LED/LD (GaN, GaAs, InP), MEMS / sensors (PZT, AlN), new memory (GST), metal films, and multilayer films. For these applications the tool provides non-destructive characterization from ultrathin single-layer films to multilayer stacks, delivering XRR and HRXRD outputs such as thickness, density, roughness, epitaxial thickness, composition, strain, lattice relaxation, crystal structure quality, RC and RSM, and twist/tilt-angle and film texture measurements.