MX3000™ 3D AOI

Overview

The MX3000™ is powered by CyberOptics’ breakthrough 3D sensing technology comprising of two MRS® Sensors delivering simultaneous dual-sided automated final vision inspection for singulated memory modules for metrology grade accuracy at production speed. Multi-Reflection Suppression® (MRS®) Technology identifies and rejects reflections caused by shiny components and reflective solder joints and suppresses multiple reflections to enable highly accurate measurements. The MX3000™ provides high resolution, dual-sided final vision inspection that doubles productivity, uses in-line multiple module grippers to minimize handing tact time, and includes autoconversion that supports RDIMM, SODIMM, VLPDIMM, UDIMM and other memory module form factors. Specifications include Inspection Speed 50 cm2/sec (2D+3D); Board Length / Board Width: Min. 25 mm / Max. 140 mm; Min. 17 mm / Max. 35 mm; Resolution Sub 10 µm; Component Height Clearance (max) 35mm. 3D measurement inspection covers lifted lead, package coplanarity, polarity dimple and chamfer identification, and component types inspected include Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors and header pins. Solder joint defect categories listed are solder bridge, opens, lifted leads, wettability, excess and insufficient solder and debris, and other detected items include Gold-finger contamination, pin-in-hole, bent pins, debris, OCR/OCV. The MX3000™ is used for simultaneous dual-sided final vision inspection of singulated memory modules. It explicitly supports inspection of RDIMM, SODIMM, VLPDIMM, UDIMM and other memory module form factors. Its MRS® technology and 3D measurement capabilities are applied where suppression of multiple reflections and metrology-grade accuracy are required, and it detects solder joint defects, component issues and other items listed such as Gold-finger contamination, pin-in-hole, bent pins, debris and OCR/OCV.