Selective Soldering Machine

Overview

Model: SUNFLOW 3/450. Independent R&D electromagnetic pump and high precision spray nozzle. Chain and roller hybrid drive system with automatic rail width adjustment. Topside hot air convection heating and bottom side infrared preheating. Support for online/offline programming, welding parameters can be set independently for each solder joint, and welding status is displayed throughout the whole process. Extensible to dual electromagnetic pumps selective soldering. Basic machine modules: Flux Module | Preheat Module | Soldering Module | Conveyor System. Overall dimension(mm)(Not include indicator light and monitor): 2710(L)*1930(W)*1630(H). Equipment Weight(kg): 1550. Max PCB size(mm): 510(L)*450(W). Min PCB size(mm): 120(L)*50(W). PCB Top Side Clearance(mm): 120. PCB Bottom Side Clearance(mm): 60. PCB process edge(mm): ≥3. Conveyor Height From Floor(mm): 900±120. PCB Conveying Speed(m/min): 0.2-10. Max PCB Weight (kg): ≥8. PCB Thickness With Jig(mm): 1-6. Conveyor Width Adjustment Range(mm): 50-450. Conveyor Width Adjustment Mode: Electric. PCB Conveying Direction: Left to right. Air Input Pressure(Mpa): 0.6. Nitrogen Supply: Offered by customer. Nitrogen Input Pressure(Mpa): 0.6. Nitrogen Consumption(m³/h): 1.5. Required Purity of Nitrogen(%): >99.999. Supply Voltage(VAC): 380. Frequency(HZ): 50/60. Max Power Consumption(kw): <30. Max Current(A): <56. Ambient Temperature(℃): 10-35. Machine Noise Level(dB): <65. Communication Interface: SMEMA. Soldering System (SUNFLOw3/450): Max. Soldering distance of X axis(mm): 510. Max. Soldering distance of Y axis(mm): 450. Max. Soldering distance of Z axis (mm): 60. Nozzle outer diameter (mm): 5、6、8、9、10、12、14. Nozzle inner diameter(mm): 2.4.3、4、5、6、8、10. Max soldering wave height(mm): 5. Solder pot capacity (kg): Approx.13kg(Sn63Pb)/solder pot; Approx.12kg(lead-free)/solder pot. Max soldering temperature(℃): 330. Soldering heating power (kw): 1.15. Preheating System: Preheat temperature range(℃): <200. Heating power (kw): 17. Heating mode: Hot air+Infrared. Top side preheating: Hot air. Spraying System: Max. stroke of X axis(mm): 510. Max. stroke of Y axis (mm): 450. Spray height(mm): 60. Location speed(mm/s): <400. Spray head automatically cleaning: Program control. Flux box capacity(L): 2. Remarks: Other models of SUNFLOW3 single pump series can be customized. Selective soldering process flow described: transport the PCB to the flux module; the spray head moves to programmed positions and applies flux only to the solder joints to be made; top-side and bottom-side preheating are applied; the programmed electromagnetic pump performs soldering to form the solder joint; the PCB is then transported out. The machine supports online and offline programming, allows welding parameters to be set independently for each solder joint, and displays welding status throughout the whole process.