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Yield Engineering Systems, Inc. (YES)Integrated Metrology

Integrated Metrology

Yield Engineering Systems, Inc. (YES)

Categories:
Batch Electroless Systems
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Model Overview

Integrated Metrology runs two wafer sizes in parallel in large batch sizes. It handles panel dimensions down to 200 μm thickness without breakage. Copper Eless provides efficient electroless plating of copper for both surface bonding and glass core liner. Glass Etch has been tested on multiple comm...

Technical Specifications

Category PathSurface Treatment > Electrochemical Processing > Electroless Plating Systems > Batch Electroless Systems
Manufacturer ID29e117c3-7a6a-44fb-90e3-6f0f1c9f0ca4
Standard Cleansmetal etch capability for Cu, Ti, TiW, Ru
Batch Processinglarge batch sizes
Glass Etch Tested Onmultiple commercially available substrates
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