ATP 1603 M

Overview

ATP 1603 M is a turbomolecular vacuum pump. It is described as quiet with low noise and vibration levels and is suited for vibration-sensitive applications in semiconductor manufacturing processes and analytical instrumentation. The pump is compatible with a variety of backing pumps and offers an excellent compression ratio for light gases. It uses magnetic bearing technology with no wearing parts and long maintenance intervals. Key technical specifications: Pumping speed Ar: 1180 l/s, He: 1220 l/s, H2: 990 l/s, N2: 1250 l/s. Compression ratio (ISO 5302) Ar: > 1 · 10⁸ l/s, He: 2 · 10⁴ l/s, H2: 3.5 · 10³ l/s, N2: > 1 · 10⁷ l/s. Ultimate pressure: < 1 · 10⁻⁸ mbar. Max. forevacuum Ar: 1.5 mbar, N2: 0.8 mbar. Max. inlet vacuum Ar: 0.027 mbar, N2: 0.4 mbar. Gas throughput at final rotational speed Ar: 600 sccm. Rotational speed: 37000 rpm; Rotational speed variable: 15000 rmp to nominal speed; Run-up time up to 90% of final rotational speed, with pressure exhaust < 0.1 mbar: < 5.3 min. Controller power supply: 200-240 V, 50/60 Hz Single-phase. Max. power consumption for start-up: 800 W. Nominal power (stand-by power): 120 W. Max. bakeout temperature: 120 °C. Sound pressure level (ISO 2151) 1m distance at nominal speed: < 48 dB(A). Vibration level at nominal speed: < 0.01 μm. Dimensions (Ø x H): 259 x 386 mm. Gas inlet: DN 200. Gas outlet: DN 40 ISO-KF. N2 purge flange: DN 16 ISO-KF. Stainless steel inlet screen (factory setting): yes. Permissible magnetic field (radial value) at 10 cm: < 12 mT. On-board control option: Profibus, Remote. Recommended backing pump: ADP/ADS. Accessories listed include installation kit; cooling water valve; purge gas valve; handheld remote controller; inlet protection screen; heater unit; valve cable and coil; various inlet flange types; and various user interfaces. Downloads available: Product Leaflet ATP 1603 M_Global EN PDF: https://www.pfeiffervacuum.com/us/assets/103146/1/Product%20Leaflet%20ATP%201603%20M_Global%20EN.pdf and Instruction Manual ATP 1603 M_EN_en PDF: https://www.pfeiffervacuum.com/us/assets/124281/1/Instruction%20Manual%20ATP%201603%20M_EN_en.pdf The pump is explicitly described as suited for vibration-sensitive applications in semiconductor manufacturing processes and analytical instrumentation. Listed markets and applications include Automotive and Transport (Space Research); Display (Physical vapor deposition (PVD)); R&D areas such as High Energy Physics, Photonics Research, Space Research, Ultra-High Vacuum and Plasma Physics; and a range of Semiconductor processes including LPCVD / Diffusion, PVD, Inspection & Metrology, Si Poly etch, Light deposition, Ion Implantation, PECVD, Lithography, Metal & high K etch, Oxyde Etch, Load Lock & Transfer, Cobalt, WCVD, TiN & TDMAT, and ALD.