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ASMPT Limited (ASMPT)AD211Plus-II
New Equipment

AD211Plus-II

ASMPT Limited (ASMPT)

Categories:
Die Bonding & Chip Attachment Systems

Model Overview & Specs

Overview

AD211Plus-II is a Heated Collet Eutectic Die Bonder. It provides high precision eutectic bonding with XY placement: XY placement: The AD211Plus-II performs high precision eutectic die bonding using a heated collet and is described as providing excellent void control and enhancing package reliability with high yield. It supports H2 forming gas handling and offers optional features including auto tip-tilt alignment, an optional smart heating system with anti-baking thermal management, and an accurate heated collet temperature health check.

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Expires September 2026

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