EcoCoat

Overview

EcoCoat is an advanced silane monolayer deposition system that supports a broad application range of organosilanes and substrates. The system provides in-situ plasma and a heating system with a maximum temperature of up to 205 °C and handles substrates up to 300 mm. The system includes three chemical delivery lines for functional organic molecules coating, including alkyl silanes, amino group, epoxy, acrylate, methacrylate compounds, fluorinated compounds, PEG and isocyanate functional silanes, and has achieved 100+ successful organosilane processes on substrates including glass, silicon, and organopolymers. EcoCoat runs two wafer sizes in parallel in large batch sizes and handles panels down to 200 μm thickness without breakage. Integrated multi-capability features include plasma cleaning, silane coating, chemical curing, onboard analysis and metrology, chemical cabinets for bulk chemical delivery, ultrasonic and megasonic agitation, specialized handling with panel shock, electroless plating (Copper Eless), ENEPIG/ENIG electroless plating processes, and metal etch capability for Cu, Ti, TiW, and Ru, with stated low COO and high throughput. Listed applications include adhesion promotion multi-layer coatings, anti-stiction coating, and surface modification. The product description also cites multi-capability processing for those coatings via plasma cleaning, silane coating, and chemical curing. Process-specific applications given in the description include Copper Eless for via liner, build-up layers, and interconnects; Glass Etch for through glass via etch and glass cavity etch for embedded devices; ENEPIG / ENIG as a final layer interface for bonding that extends package lifetime and protects copper layers from oxidation; Metal Etch for seed metal etch; and Standard Cleans for front end particle cleans and post SiC wafer cleans.