CMP Orbis System

Overview

The Logitech Orbis CMP System is a precision-engineered, floor-standing CMP platform designed for R&D, pilot production, and advanced materials development. It supports all die, partial wafers, and wafers up to 200mm (8") using dedicated carriers, and can process two 200mm samples simultaneously. Power Supply: Single Phase, Neutral, Earth. 220v – 240v; Fuse Rating: 25A RCBO. Plate Diameter: 600mm; Plate Rotation: Forward & Reverse direction settings; Plate Speed: 0-160rpm (the product page also lists "High plate speed, variable up to 300rpm"). Carrier 1: Speed 10-125rpm; Carrier 2: Speed 10-125rpm Max; Carrier Sizes Available: 100mm (4"), 150mm (6"), 200mm(8"). Height: 1950mm; Depth: 735mm – 785mm (including front bar); Width: 1680mm + control arm (180mm flat); Net Weight: 590Kg; Gross Packed Weight: 830Kg. The system includes downloadable data capabilities, industry-standard pad conditioning, compatibility with Logitech post-CMP cleaning solutions, advanced sensors that provide consistent, real-time process information, and quick and easy plate and jig set-up; it also notes that high downloads from the carrier head increases the polishing rate. Chemical Compatability: Acidic & Alkaline CMP Slurries. The Orbis CMP System is intended for R&D, pilot production, and low-volume production testing where high-precision CMP is required. Explicitly supported application areas include back-end IC manufacturing, MEMS, Opto-MEMS, and Bio-MEMS fabrication, packaging, assembly and fabrication tasks. The product page also cites use in Tribology Science and Research, including coefficient of friction monitoring (CoF), and supports processes such as wafer slicing, surface preparation, and thinning of III-V, IR and similar materials for devices like transistors, ICs, and IR detectors.