Endura® ALPS® PVD (ALPS Co & Ni)

Overview

The Endura® ALPS® PVD (ALPS Co & Ni) is a physical vapor deposition (PVD) system in Applied Materials’ Endura product family configured specifically to deposit cobalt (Co) and nickel (Ni) thin films for semiconductor manufacturing. It deposits wafer-scale metal films by PVD (metal source/target evaporation/sputtering in vacuum) to form controlled Co and Ni layers. The tool is positioned for metals-deposition process steps in semiconductor fabrication, emphasizing controlled film composition and thickness for metallization applications. Key, verifiable technical identifiers: process type = PVD; materials handled = Co and Ni; product family = Endura ALPS. Typical use cases are semiconductor wafer-level metallization steps that require cobalt or nickel thin films, such as contact, via, or interconnect metal layers and related process-development work in fabs and manufacturing R&D. The system is used where PVD sourcing of Co and Ni is required and is selected based on line integration needs (wafer size, throughput and cluster/configuration choices) and downstream process compatibility. It serves both production and process-development environments in semiconductor device manufacturing where precise, repeatable metal film deposition is needed.