SQ3000M2

Overview

The SQ3000M2 is an automated optical inspection (AOI) system described as "Superior performance ideal for wirebond applications" and as ensuring product quality is maximized. Field-of-View (FOV) is 8.2 x 6.8mm (0.32 x 0.27 in.) (1X) and resolution is 3.4µm (1X). Lighting is Proprietary Fusion Lighting™ multiangle LED and imaging is delivered by a 5-megapixel color camera (2448 × 2048). Optics are proprietary high resolution, low distortion with coaxial illumination and an optional FV Metrology module; AFVM - Metrology module is listed as FVM - Focus Variation Measurement sensor, and supported device types include JEDEC, MCMs, Hybrids, FlipChip, BGA, microBGA, MEMs, and waffle pack. System dimensions are 110 x 128 x 143 cm (W x D x H) with height excluding signal-light pole and levelling feet, and weight is ≈ 965 kg (2127 lbs.). Options include SPC software, Barcode Readers (1D/2D), Programming Software: ePM-AI, Offline Defect Review, Certification Target, CMM Capability, AI Capability, Secondary optics (5X or 10X), and Tertiary optics (0.5X). The SQ3000M2 is described as ideal for wirebond applications and as a system to improve yields, processes and productivity while reducing costly returns from the field. The Nordson Test & Inspection line of AOI systems is presented as providing a variety of inspection solutions ideally suited to meet the demands of the aerospace, automotive and transportation, and medical industries, and as offering cost-effective, integrated yield enhancement solutions for PCB Assembly and for advanced semiconductor packaging.