LDGS 300 A

Overview

The LDGS 300 A is a fully automatic laser dicing and edge grinding system suitable for dicing, edge-grinding, drilling and slotting of wafers. It performs multi-directional 2D-cutting and grooving operations and offers removal of micro-cracks on the wafer edge to improve fracture strength. The system uses a Diode pumped solid state Nd:YAG, pulsed laser with wavelengths 355/ 532 nm and operates on a 2-axis motion system within a working volume of 300 x 300 mm (W x D). Specified accuracy is +/- 3 µm and repeatability is +/- 1 µm. Performance details include a cutting speed of up to 200 mm/s for thin wafers (< 50 µm), kerf width down to 30 µm, and features such as water jet cooling and a long working distance that removes the need for focus control. The machine dimensions are 2260 x 1800 x 2350 mm (W x D x H). The LDGS 300 A is used for wafer dicing, edge grinding, drilling, slotting, grooving and multi-directional 2D-cutting. It processes materials including Silicon (Si), gallium arsenide (GaAs), silicon carbide (SiC), low-K materials and coated materials such as Epoxy molded compound wafers. Its capabilities include removal of micro-cracks on the wafer edge to improve fracture strength, very small kerf widths down to 30 µm, and high cutting speed up to 200 mm/s for thin wafers (< 50 µm).