EVG®805 Debonding System

Overview

The EVG®805 Debonding System is a system for debonding temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool supports thermal or mechanical debonding with specific debond options including Thermal slide off debonding, Lift off debonding and Mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools, and the system includes unique features for thin-wafer handling. It provides an open adhesive platform, recipe controlled operation, real time monitoring and recording of all relevant process parameters, and various chuck designs to support wafer/substrates and carriers. Configuration includes 1 debond module and the system supports wafer diameter up to 300 mm and up to 12” film frame, with optional UV-assisted debonding, high topography wafer handling and bridge capability for different substrate sizes. The EVG®805 is used for thin wafer debonding of temporary bonded and processed wafer stacks composed of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. It supports thermal slide off, lift off and mechanical debonding methods and can unload thin wafers onto a single substrate carrier for safe transport between tools. The system accommodates wafer/substrates and carriers up to 300 mm and up to 12” film frame and can be equipped with options such as UV-assisted debonding, high topography wafer handling and bridge capability for different substrate sizes.