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Kulicke and Soffa Industries, Inc. (K&S)POWERNEXX14

POWERNEXX14

Kulicke and Soffa Industries, Inc. (K&S)

Categories:
Die Bonding & Chip Attachment Systems
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Model Overview

POWERNEXX 14 is a ball bonder intended for forming ball bonds in semiconductor device packaging and related wire-interconnect processes. The product name is provided exactly as POWERNEXX 14. The equipment class (ball bonder) indicates precision thermosonic/thermocompression bonding capability for cr...

Technical Specifications

Bond Typeball bonds
Intended Usesemiconductor device packaging and related wire-interconnect processes
Product NamePOWERNEXX 14
Category PathAssembly & Packaging > Component Placement > Die Bonding & Chip Attachment Systems
Equipment Classball bonder
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