4800 INTEGRA®

Overview

The 4800 INTEGRA® is a complete automated bond test solution for semiconductor wafer bond testing, designed for maximum throughput in an operator free environment. It is described as the next generation automated bond test solution with new motion, vision, and wafer handling systems and is enabled by Paragon software and Matrix Map software. Size: All configurations:- 1075mm x 980mm x 855mm (ex PC) Weight: 170Kg Power supply: 90 - 264V AC, 47 - 63 Hz, Single Phase, Universal Pneumatic supply: Minimum 4 bar, 6mm OD / 4mm ID plastic pipe Vacuum supply: Minimum 67kPa, 6mm OD / 4mm ID plastic pipe Interfaces: USB, Gigabit Ethernet The XY Stage provides 550mm X travel and 410mm Y travel with high resolution linear encoders, and the Z Axis provides 75mm Z Travel. Total system accuracy is specified as up to +/- 0.05% FSD (See cartridge specification). Integrated image capture and optical/camera systems include a high power microscope, trinocular camera, alignment camera (large FOV), side alignment camera, and borescope. The system includes an edge lift smart chuck with gradual vacuum pressure, a smart load port and wafer chuck, Lipseal™ technology for warped wafers, and a multi-function programmable chuck controller that provides feedback on vacuum clamping pressures and continuous vacuum and air level monitoring. The 4800 INTEGRA® is used for micro bump and trace bond testing on chip-on-wafer, stacked wafer, and molded wafer applications and supports both 200 and 300mm wafers. It is presented as delivering hands-free and fully traceable bond testing capability for wafer-level packaging. Integration with a wafer handler transforms the system into a fully automated, reliable, and repeatable solution using Paragon software, which enables automated test routine development, a step-by-step setup wizard, and simultaneous display and recording of views from multiple cameras. The system is described as ready for further automation using Nordson Intelligence for easy Autograding routines and can automatically justify wafers or panels with +10mm of warpage.