SRO-716 vacuum soldering system

Overview

The SRO-716 is a vacuum soldering system that uses direct IR heating via an arrangement of 12 IR emitters in 3 zones and adjustable heating zones to ensure homogeneous temperature distribution. The process chamber is heated to a process temperature of 450 °C, optionally up to 750 °C, and features an exchangeable heater plate and multiple TC monitoring. The heated area measures 314 × 314 mm with a maximum product height (clearance) of 95 mm. Chassis dimensions are 1,090 x 630 x 1,830 mm and weight is 200 kg. Standard vacuum capability is 0.05 mbar, with an optional high vacuum configuration achieving <5×10-5 mbar using scroll and turbomolecular pumps, and oxygen levels of <3.0 ppm when using purified N2. The system supports solder paste or preform processes, flux-less or flux operation, and includes options for overpressure, Topheater, H2/N2H2 compatibility, high vacuum, and flux management. The SRO-716 is presented as a central element in R&D centers and pilot productions for vacuum soldering and brazing. Explicit device and package applications listed include Power semiconductor (IGIBT, SiC-MOSFET), Sensors, MEMS devices, Die Attachment, High-power LED, Hybrid assembly, Flip Chip, and Package sealing. Optional configurations support specific process needs: an overpressure variant for void-free solder joints; a solder paste flux-management variant with an integrated flux hood for clean, high-precision soldering; a high vacuum variant (<5×10-5 mbar) with N2-controlled cooling and an HCOOH step to optimize wetting under WinATV process control; a Topheater variant for thermally demanding soldering; and an H2 variant for removing surface oxides with hydrogen or forming gas to improve wettability.