ComBondae

Overview

EVG ComBond® is a fully automated high vacuum wafer bonding system that arranges modules in a cluster format. The platform can be configured to address requirements ranging from research and development to high-throughput production. It supports up to 6 modules and base substrates up to 200 mm. Achieved vacuum levels are: transfer < 7E-8 mbar and process < 5E-8 mbar. The system provides in-situ sub-micron-level face-to-face alignment and in-situ interface treatment including oxide removal, enabling electrically conductive bonding and bonding of dissimilar material pairs with different lattice constants and coefficients of thermal expansion (CTE). Operation/process module options include Bond module, ComBond® activation module (CAM), Bake module, and Vacuum Alignment Module (VAM); process modules range from minimum 3 to maximum 6, and loading options include manual, cassette, and EFEM. The system supports room-temperature or low-temperature processes for multiple material combinations including metals (aluminum), producing stress-free bonding interfaces and high bond strength. Supported application areas explicitly listed for EVG ComBond® include advanced substrate fabrication, stacked-type solar cells, power devices, high-end MEMS packaging, high-performance logic, and beyond CMOS devices. In-situ high-vacuum interface treatment and oxide removal enable high-vacuum bonding of MEMS and optical devices. The system's high vacuum capability also enables low-temperature bonding of metals that re-oxidize in air, such as aluminum. The modular cluster architecture and full automation allow configuration for both R&D and high-throughput production environments, with support for up to 6 modules and wafers up to 200 mm.