Semiconductor reflow oven SEMI series

Overview

Model: SEMI-08N, SEMI-10N, SEMI-13N. The solder paste printed on the convex metal surface is refluxed into a ball to complete the combination welding of the tin ball and the substrate. After the chip is placed to the PCB, the chip and the circuit board are connected together to realize the chip packaging and integrated circuit manufacturing. The system uses a hot air system with patent, providing efficient heat compensation ability and accurate temperature control accuracy. The oven provides full-process nitrogen protection with independent nitrogen control in each temperature zone and controls low oxygen content within 50-200PPM during the whole process. The oven has a modular design and an efficient cooling system with a cooling slope that can reach 0.5-6°C/S. Heating zone structure: SEMI-08N — 8 heating zones, 16 heating modules; SEMI-10N — 10 heating zones, 20 heating modules; SEMI-13N — 13 heating zones, 26 heating modules. Heating zone length: 2950mm (SEMI-08N); 3670mm (SEMI-10N); 4750mm (SEMI-13N). Heating up time: 20min (SEMI-08N); 25min (SEMI-10N); 25min (SEMI-13N). Outlet Exhaust Diameter, valume: 2-Φ145, Exhaust demand 10m³/min x2. Cooling: three cooling zones with forced water cooling and a cooling zone length of 1250mm; chiller power 5P Water chiller (Optional: connected to customer workshop cooling water). Conveyor type: Fine mesh mesh belt (Optional: B-shaped mesh belt, force bone mesh belt). Conveyor direction: left→right, right→left / L→R, R→L. Conveyor height: 900±120mm. Mesh belt width: 24" (Other width sizes can be customized.). Component height: 20mm. Conveyor speed: 300mm-2000mm/min. Power: AC3Ø 5W 380V 50/60Hz. Total Power: 70kW | 89kW | 118kW. Startup Power: 35kW | 38kW | 42kW. Normal consumption: 10kW | 12kW | 14kW. Temperature control range: Room temperature to 320°C. Control type: PC+PLC Control system. Temperature control accuracy: ±1°C. PCB temperature deviation: ±1.5°C. Data Storage: Process Data and status stotage. Power outage protection: Equipped with UPS. Operation interface: Windows Chinese simplified, English online free switching. N2 area: Full nitrogen filling. Secs/Gemcommunication protocol: Standard. MES communication protocol: Standard. Computer: Commercial computer. Dimension (LxWxH): 5680x1710x1650mm | 6400*1710*1650mm | 7500*1710*1650mm. Weight: 2400-2600kg | 3200-3400kg | 3600-3800kg. Flux recovery system: Standard. Color: Bright wrinkled white. The oven refluxes solder paste into a ball on convex metal surfaces to complete combination welding of tin balls and substrates. After chip placement onto a PCB, the oven connects the chip and the circuit board to realize chip packaging and integrated circuit manufacturing.