Custom Heller Vacuum Reflow Oven

Overview

Custom Heller Vacuum Reflow Oven is a conveyorized reflow soldering system equipped with an integrated vacuum capability to perform solder reflow under reduced pressure, reducing solder joint voiding and improving reliability. The oven provides controlled thermal profiling across the standard reflow stages (preheat, soak, reflow, cooling) with zoned temperature control and repeatable process control to maintain set profiles. Designed as a custom-configurable production component, it is intended for inline integration with SMT production lines and can be specified to match conveyor interfaces, process control/automation requirements, and production throughput targets. Used in industrial PCB assembly and manufacturing R&D contexts where minimizing solder voids and maximizing joint integrity are critical — for example assemblies with BGAs, QFNs, power electronics, and high-reliability electronic products. Installed as part of an SMT line for continuous inline reflow under vacuum, it supports production workflows for OEMs, EMS providers, and high-reliability electronics manufacturers. Custom configuration options allow the oven to be adapted to specific board sizes, throughput requirements, and control-system integration needs.