XHEMIS TX-2000

Overview

The XHEMIS TX-2000 is a total reflection X-ray fluorescence (TXRF) system and the successor to Rigaku's TXRF 3760, redesigned to meet the latest SEMI, EMC, and UL standards while introducing advanced automation, digital control, and machine-learning capabilities. It performs in-line, non-destructive quantification of ultratrace metallic contaminants on wafer surfaces and supports Si, SiC, GaN, glass, and sapphire samples up to 200 mm wafers. Built-in features include an integrated FFU for clean wafer transfer, transparent-substrate compatibility with an Ori-flat notch search sensor, a safety PLC that monitors EMO buttons, power, exterior panels, vacuum switches, and cassette doors, a dual interlock system with an added cassette door, presence and size detection, and IP22 / IP42 enclosure protection. The instrument conforms to SEMI S2-0818E / S8-0218 / S14-1016 / IEC60204-1:2016 (NFPA 79:2021) / UL 508A 3rd and SEMI F47; footprint is approx. 1050 (W) x 2020 (H) x 1025 (D) mm (compact fab-fit design) and power is 200 V AC (DC24 V control system). The TX-2000 is intended for surface-metal control and contamination control in semiconductor fabs for wafers up to 200 mm, providing in-line, non-destructive measurement of ultratrace metallic contaminants on wafer surfaces for Si, SiC, and GaN device manufacturing. Explicit application examples include evaluation of surface contamination of SiC and GaN power device wafers (RSMD005) and evaluation of wet cleans in SiC power MOSFET fabrication by TXRF (RSMD001). An optional machine-learning spectral prediction is provided to reduce measurement time by predicting spectral profiles from process recipes.