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Applied Producer HARP (High Aspect Ratio Process)
Applied Material
Categories:
DLP & MSLA Resin Printers
Stereolithography Systems
Model Overview
Applied Producer HARP (High Aspect Ratio Process) is a semiconductor wafer-processing platform focused on formation and modification of high-aspect-ratio features — deep, narrow trenches and vias — where control of sidewall profile, critical dimension (CD) and feature conformality is required. The p...
Technical Specifications
Process Typeformation and modification of high-aspect-ratio features
Category PathAdditive processing > Vat Photopolymerization > DLP & MSLA Resin Printers
Equipment Typesemiconductor wafer-processing platform
Repeatabilityrepeatable across-wafer performance
Manufacturer ID3ac7ba29-f554-4cc9-b2f6-a655474b1267
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