PCB copper-tin coating line

Overview

Peripheral equipment: PCB медно-оловянная покрытие линии. The function of the copper‑plating line is the thickening of the copper layer on the panel surface and in conductive holes. Panels act as cathodes for electroplating; the copper surfaces of panels are cleaned and activated in a series of baths and then electroplated. The operator starts an automated plating line and the entire process is controlled by a computer to ensure each set or flight of panels remains in each bath the exactly required time. Process flow: Acid dip → Degreasing → Double rinse → Micro‑etch → Double rinse → Acid wash → Copper plating line → Double rinse → Acid dip → Tin plating → Double rinse → Rinse → Hot air drying → Discharge. Used to increase copper thickness on PCB panel surfaces and inside conductive holes. The line can plate filled holes. Test data provided: aspect ratio 20:1; panel thickness 4 mm; result TP110. Features include an achievable aspect ratio of 20:1 and a minimum hole size of 0,15 mm, with main parts noted as from a known Chinese brand.