Esec 2100 SC

Overview

The Die Bonder Esec 2100 SC is a 300 mm high speed platform and is described as capable of running the smart card tape; it was awarded the Swiss Technology Award at its introduction. Bonding method: Epoxy. Bonding accuracy: Down to 25 b5m @ 3c3. Wafer size: 4" to 12" (on 8" or 12" wafer frames). Die size: 0.5 mm to 20 mm. Tape size: Width: 35 mm. Machine dimensions: 3040 x 1448 x 1680 mm (W x D x H). The platform includes a 50 N bond force standard and a third process station. Key machine features include a single clamp transport system, 100% post bond QC inspection at high speed, camera-performed key alignment tasks, and optional 3 zone heating for pre-curing (accuracy) and void control (dehumidification). Operational aids listed include real time process monitoring through 4 live images of process zones, real time wafer/tape/magazine viewers, Phi-Y Pick and Place with symmetrical design for short settling time, vibration control and high stiffness for placement accuracy and speed, tool-less product exchange, teach and setup wizards with parameter teach verification, and recipe transfer from machine to machine. Used as a high-speed die bonder platform for 300 mm processes and specifically capable of running smart card tape. It supports workflows requiring high placement accuracy (Down to 25 b5m @ 3c3), 50 N bond force, and a third process station for expanded process steps. Designed to support production through 100% post-bond QC inspection, real-time process monitoring (4 live images and real time wafer, tape and magazine viewers), fast product changeovers via tool-less exchange and recipe transfer, and a range of optional modules for tape handling, dispensing, pick & place, vision, automation and other utilities as listed in the product options.