PI Primo - 3D SPI

Overview

PI Primo - 3D SPI is a solder paste inspection system with a large 3D field of view designed to support faster cycle times. It uses a patented Z-referencing technology to measure paste volume and leverages hundreds of references across the ultra-large 3D field of view. Repeatability is provided by multi-frequency, multi-pattern moiré and a patented dual Z-axis motion. The system performs effortless auto-programming: a single bare board scan programs the machine, with no fine tuning and no manual calibration required. An intuitive touchscreen interface enables setup and operation after approximately one hour of training, and calibration is performed via a single button press. The PI series provides extra-large 3D review images for diagnostics and implements automatic pad grouping by area aperture ratio (AAR). It offers a built-in closed-loop function and a patented Z-referencing method that leverages the entire textured 3D board information to define a stable and accurate Z-reference. The PI Primo - 3D SPI inspects solder paste deposits on printed circuit boards, including jet-printed and screen-printed deposits, and measures paste volume with high accuracy. It can be used in a closed-loop workflow with the MY700 jet printer to communicate insufficient paste information for repair without washing and reprinting. The system also supports real-time process monitoring with MYPro Live and production reporting and trend analysis with MYPro Analyze, and its extra-large 3D review images assist in diagnostic review.