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Icarus Indium Solder Bump Deposition System
Intlvac Thin Film Corporation
Model Overview
The Icarus Indium Solder Bump Deposition System is optimized for high-volume production and designed to deliver rapid turnaround with repeatability. From pressing "start" to retrieving a fully processed 200 mm wafer takes less than 90 minutes, and the system is claimed to complete 200 mm diameter wa...
Technical Specifications
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