Electra-UHV Sputtering Deposition System

Overview

The Electra-UHV Sputtering System by Intlvac is a compact, purpose-built platform engineered for advanced thin film deposition in ultra-high vacuum (UHV) environments, achieving base pressures in the 10⁻¹⁰ Torr range. It is equipped with Intlvac’s proprietary LabVIEW-based controller that enables automated sputtering of magnetic metals and insulating materials, and the system is fully customizable to meet a wide range of material and process requirements. The Electra-M variant includes a load-lock system for pre-loading and degassing single or multiple substrates, supporting high-throughput workflows and reducing contamination risks. - Compact ‘D’-shaped clamshell chamber - Up to 6 × 2″ magnetron sputter sources - Base pressure < 5 × 10⁻⁹ Torr; typical base pressure (overview): 10⁻¹⁰ Torr range - Accommodates substrates up to 100 mm wafers - Substrate temperature up to 800°C; substrate rotation, heating (800°C), or cooling with optional bias - Rotating substrate holder for high-temperature stability - Configurable with ion assist sources; ion source available for substrate cleaning or assist during film growth - Deposition configurations available in sputtering and evaporation; magnetron sputtering modes: RF, DC, or Pulsed DC - Load-lock chamber with magnetic manipulator for 100 mm wafer transfers; customizable substrate fixtures: single, multiple, planetary, or specialized designs - Compatible with 100 mm wafers and smaller carriers Explicit key applications listed for the Electra-UHV system include MRAM development, metallization processes, crystal growth research, oxide and nitride film deposition, and magnetic material prototyping. The system is described as ideal for prototyping and research & development of cutting-edge materials.