X7500 Standalone Industrial CT Scanning System

Overview

The X7500 Standalone Industrial CT Scanning System is the standalone manipulator variant of North Star Imaging’s X7000 family and is described as having the largest scanning envelope and longest focal distance of the standard systems. System features include DICONDE compliance, Integrated Process Controls, Integrated efX Software Suite, Integrated Motion Control, and availability with an automated Dual RobotiX add-on. Advanced imaging modalities listed are SubpiX, VorteX, MosaiX, and Ring Reduction. X‑ray source specifications list a Voltage Range: 10 kV – 450 kV and a Minimum Focal Spot Size: ~2 µm, with tube types including Microfocus – Reflection, Microfocus – Transmission, Microfocus – Dual Head, and Minifocus; an optional dual tube configuration is available. Digital X‑ray detector options include Flat Panel (DDA) and Linear Diode Array (LDA) with Grade Options: Premium and Superior (ASTM); Pixel Pitch is DDA: 100-200 µm and LDA: 200-400 µm. Maximum Detector Size is given as DDA: 17 in x 17 in [43.2 cm x 43.2 cm] and LDA: 36.3 x 0.03 in [92.2 x 0.08 cm], with an optional dual detector configuration. Manipulator and motion specifications include Maximum Sample Weight: 500 lb [227 kg]; Part Travel — Horizontal: 48 in [121 cm], Source to Detector: 68 in [172 cm]; Tilt: +20°/-20°; Rotation: 360° Continuous; Nominal Part Envelope: 60 x 60 in [152 x 152 cm]; and Maximum Focal Distance: 90 in [228 cm]. Part manipulation is described as all drives variable speed joystick controlled with each axis independently controlled, and Control‑X provides programmable CNC controlled automated scanning with automatic image processing and archiving capabilities. CT software functionality includes a 5-step guided wizard for 3D reconstruction, comprehensive acquisition/processing/archival programs, non‑proprietary multiple image format support, a Computed Tomography acquisition module, 3D reconstruction and visualization, and an optional 4D Computed Tomography module. Stated applications include Failure Analysis, Assembly Verification, Reverse Engineering, Density Analysis, Finite Element Analysis, and Void and Porosity Analysis. The system is also listed for 2D and 3D Metrology, Internal and External Measurements, Product Quality Compliance, and 3D CAD comparisons. Additional applications cited are Research and Development (R&D), Weld and Braze Quality Analysis, In Situ Monitoring, and Additive Manufacturing System Qualification.