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JetFirst Lamp furnace - Rapid Thermal Processing
ECM TECHNOLOGIES (ECM)
Model Overview & Specs
Overview
The ECM JetFirst RTP system is a compact and robust lamp vacuum furnace for heat treatments such as Rapid Thermal Annealig (RTA) of a wide range of material substrates and structures (Electronic Grade Si, steel glass, SoG c-Si, III-V, II-VI, Germanium, quartz, ceramics etc.) with a size from 100mm up to 300mm diameter. This lamp furnace is equipped with a metallic water cooled reactor chamber and has therefore an ultra-low memory effect, and the lamp array, upper flange, and quartz window are mounted in a rotating top lid to give full access to the chamber for easy loading and unloading of the wafer. The process can take place at atmospheric pressure or under vacuum, temperature control is provided by a PID system and a temperature measurement control system that deliver accurate and repeatable thermal control across the temperature range, and RTP process control is via computer running a PIMS dedicated supervisor that enables recipe programming and monitoring of the entire RTP system. Silicon carbide coated graphite susceptors are available for processing various small samples and compound semi materials, a spare process chamber can be provided upon request to avoid cross contamination, and optional accessories include Primary vacuum pump, Secondary vacuum pump, Process gas line, Susceptor, High temperature version, Spare chamber, and Hydrogen configuration. Possible applications explicitly listed for the JetFirst include Rapid thermal annealing (RTA), Rapid thermal oxidation (RTO), Rapid thermal nitridation (RTN), Rapid thermal diffusion (RTD), Crystallization, carbonization, Contact alloying, and Selenization (with optional hardware). The JetFirst system has been developed to meet the requirements of universities and research laboratories, and its high reliability and high performance characteristics enable small-scale production.
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