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Angstrom Engineering Inc.ALD One ®

ALD One ®

Angstrom Engineering Inc.

Categories:
Additive processing
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Model Overview

ALD One ® is an atomic layer deposition system designed for both thermal ALD and plasma-enabled processes, with process control features aimed at contamination-free thin-film manufacture. Key technical characteristics: - Substrate compatibility: Up to Ø300 mm wafers or 210 mm × 210 mm (M12/G12) sola...

Technical Specifications

Plasma SourceClean, oxygen-free nitride processes.
Glovebox IntegrationControlled environment for sensitive materials.
Substrate CompatibilityUp to Ø300 mm wafers or 210 mm × 210 mm (M12/G12) solar wafers.
Film Thickness Uniformity±1% (1σ) for thermal ALD of Al₂O₃ on a ø200 mm wafer.
Advanced In-situ MonitoringReal-time film growth tracking with ellipsometry & quartz crystal monitoring.

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