ERSASCOPE X

Overview

ERSASCOPE X is a versatile inspection system developed for optical inspection and digital image capture, including measurement of solder joints on BGAs and other SMT components. The system offers two quick-change objectives: 90° BGA optics (approx. 280 µm gap) and a 0° macrozoom inspection lens. It has integrated, dimmable LED lighting and an additional LED light source with gooseneck and light fan. A 1/3" N-MOS solid-state color image sensor camera with resolution 5.0 MP is integrated and connects via USB 2.0 (USB-A, length 2.5 m); the camera measures 114 x 36 x 51 mm (without cable) and weighs approx. 210 g. The built-in lens provides a 3 mm image field, focus is set via an integrated focus ring, and light intensity is controlled by a potentiometer (0-100%). Overall dimensions (LxWxH) are 480 x 550 x 400 mm and the system weight is ca. 9 kg. Construction materials include aluminum, stainless steel and plastic; the unit is height-adjustable, swiveling and extendable with a Z-axis fine adjustment and a mount for the basic camera unit. The base has a diameter of 320 mm and weighs approx. 5 kg; the adjustable support measures approx. 170 x 196 x 98 mm and weighs approx. 2.1 kg. The unit is available in an antistatic version and provides a connection flange for MOBILE SCOPE optics plus a 15 mm connection for the light source with a gooseneck light guide and light brush. ERSASCOPE X is designed for optical inspection and digital image capture, explicitly including measurement of solder joints on BGAs and other SMT components. The system supports visual inspection of components on PCBs in SMT or THT, inspection of PCB surfaces and solder paste prints, and fast inspection of concealed solder joints during stationary inspection. It is suited for high-resolution inspection of 0201 components, for visual inspection of a BGA test component with an edge length of 135 mm, and it includes Ersa ImageDoc v3 inspection software (basic version) for inspection documentation.