ULTRASONIC 65 2nd Generation

Overview

ULTRASONIC 65 2nd Generation. Max. X-axis travel: 735 mm28.9 in. Max. Y-axis travel: 650 mm25.6 in. Max. Z-axis travel: 560 mm22 in. Max. workpiece diameter: 840 mm33.1 in. Max. workpiece height: 500 mm19.7 in. Max. workpiece weight: 1000 kg2204.6 lbs. Control & software alternatives: SIEMENS. ULTRASONIC technology integration via HSK-A63 / HSK-E50 actuator system includes ULTRASONIC superimposition of the tool rotation with amplitudes up to > 0.254 µin., automatic frequency detection -adaption, amplitude regulation and automatic feed adjustment. The ULTRASONIC system is stated to enable up to 50% reduced process forces, higher feeds, surface finishes up to Ra < 0.00254 µin., and longer tool life. Machine design and options include a large door opening of 1,500 and a footprint of only 129.2 ft², unrestricted crane loading of up to 3,306 lb, three-point support, comprehensive cooling measures, high-performance coolant unit and multi-sensor compensation as standard, and an optional precision package delivering 15 % higher precision. The stiff monoBLOCK concept comprises a one-piece column with 2.2 in. roller guideways in all axes and large ball screws in all axes ø 50 / 50 / 50. Available equipment details include machine-integrated tool magazines with up to 180 pockets, table solutions for 5-axes machining with up to 3,306 lb or complete machining with milling and turning with up to 1,512 ft lb, and a spindle range up to 30,000 rpm or with up to 317.2 ft lb. Listed sample applications and target sectors in the product information include Mobility, Semiconductor, Engineering, Aviation & Space, and Plant Engineering. Specific components cited across those listings are: Center console, Motor block, Frame swing, Showerhead, Camera housing, Quartz glass ring, Housing component, Housing zerodur, Camera housing aluminum oxide, Sealing rings silicon carbide, Mirror support, Blade, Brake disk, and Wafer Chuck. Documented ULTRASONIC technology cycles and sensors describe explicit process uses: ULTRASONIC axialGRINDING for grinding rotationally symmetrical structures in hard-brittle materials and for manufacturing bearing rings, wafer chucks and microwave windows for semiconductor, optics and technical ceramics applications; ULTRASONIC microDRILL with ULTRASONIC 3rd Generation and 32.000 rpm for micro drilling with drilling diameters from 0.1 mm – 2.0 mm and capability for several thousand holes per part without manual interaction; intoolSENSOR for automatic detection of contact with the workpiece and tool breakage detection, supporting precise drilling depth independent of tool wear.