Microace 66

Overview

The MicroAce 66 is a 6" automatic dicing saw configured with a 2.4kW spindle as standard while other spindle set-ups are available. It uses the Loadpoint NanoControl 2.10 control system with a force-sensitive keypad and integrated tracker ball. Work capacity (XYZ) is 152 x 152 x 16mm with blade capacity 50 - 76.2mm (101.6mm option available). Spindle options and performance data provided include 1.8 KW @ 60,000 rpm, a high power option 3.0 KW @ 10,000 rpm, and a spindle speed range of 3,000 - 60,000 rpm. X axis cutting range is 160 mm with 0.1 µm resolution and 0.1 - 500 mm/s feed rate; Y axis index range 0.001 - 152 mm with 0.1 µm resolution and index accuracy ± 3 µm / 200mm < ± 1 µm / 10mm; Z axis index range 0.001 - 20mm with 0.1 µm resolution and index accuracy ± 2 µm / 10mm. Theta axis is direct drive torque motor, 360° continuous range with 4 arc sec resolution. Vision, tooling and workholding details include monochromatic or full colour camera options at 2 MegaPixels with magnifications x150, x200 and x300 and coaxial and ring illumination (dark field option). Tooling includes a standard wheel carrier for 50 to 76.2mm blades, three-direction coolant delivery, and an accelerometer-based Z datum set with off-chuck height sensing. Work holding is via ceramic or metal vacuum chuck, with Loadpoint-manufactured chucks and precision-ground ceramic inserts available. Footprint (W x D x H) is 570 x 1215 x 1555 mm and weight is 570KG on 4 adjustable feet (up to 10mm). Service requirements include 220/240v AC single phase 10A, 50/60Hz electricity; air supply 5.5 Bar (80 PSI), 0.11m3/min (4 CFM), dewpoint 5°C, Oil 0.005 PPM; blade coolant 3 - 5 Bar and 5 - 8 Litres/min (1.3-2.1 US gal/min); spindle coolant 3 - 5 Bar, 18 - 20°C recirculating coolant temp, 1 Litres/min (0.26 US gal/min); vacuum supply not required (internally generated); mist extraction mandatory 4m3/min; drain 42 mm ID, drain height < 600 mm (24") from base. Pipe/port sizes include cutting wheel blade coolant in 10mm, wafer wash water in 10mm, spindle coolant water out 10mm, air in 10mm, vacuum venturi exhaust 10mm, mist extraction port 40mm and drain port 40mm. The MicroAce 66 is presented for dicing solutions across SEMICONDUCTORS, OPTICAL, ELECTRONICS, MEDICAL, FERRO-ELECTRONICS, SOLAR, OPTO-ELECTRONICS and SONAR. It can be used for a wide range of applications beyond silicon wafers and is described as suitable from prototype to production, including the latest wafer designs and ceramic components. Materials explicitly listed as processable include Ceramic, FR3/FR4, GaAs, Germanium, Glass, InP, LED’s, Lithium Niobate and Tantalate, QFN, Piezo electrics, PZT, Quartz, Sapphire and Silicon. The product text states cut depths of up to 16MM.