Compound Electron Beam Evaporation Coating Machine for Electronics

Overview

SIMVACO Compound Electron Beam Evaporation Coating Machine for Electronics is a high-performance vacuum deposition system that utilizes Electron Beam Evaporation Technology. Model: E-Beam Evaporation Coating System. The vacuum chamber size is 500×500×600 mm and the system achieves an ultimate vacuum of ≤6.67×10^-4 Pa. Electron gun voltage options are 6 kV / 8 kV and the power supply is adjustable up to 10 kW. Substrate heating temperature is up to 800°C ± 1°C and rotational speed is 5-60 RPM. Deposition rates range from 0.1 nm/min to 100 nm/min and film thickness is monitored by a quartz crystal oscillation monitor. The process minimizes contamination by focusing heat directly on the target material rather than the entire crucible and is suitable for metals, dielectrics, and complex multilayer structures. The system operates in an ultra-high vacuum environment of 10^-3 to 10^-4 Torr and includes full process automation with automated substrate handling, deposition, and diagnostics. Energy-efficient design and an efficient pumping system featuring a turbomolecular or cryo-pumping group are included, along with advanced control systems such as programmable sweep controllers, real-time monitoring, a touch screen control panel, and customizable options including multiple crucibles and integrated load-lock systems. Deposits precision thin films for semiconductor devices including ICs, transistors, and diodes. Provides uniform coatings for display technologies such as OLEDs, LCDs, and touch panels. Coats sensitive components used in advanced sensor systems and enhances efficiency and reliability of optoelectronic devices including LEDs, lasers, and photodetectors.