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MB TECONNECT®
MB Automation (Mühlbauer / Muehlbauer)
Categories:
Die Bonding & Chip Attachment Systems
Model Overview
MB TECONNECT® is described as the most advanced, reliable and economical Dual-Interface solution for smart-card production. It is offered to enable the production of smart cards for ID and Banking with very low operating costs per card. MB TECONNECT® holds CQM©, VISA©, Union Pay© and MIR© certifica...
Technical Specifications
Yieldmore than 99,5% yield
Paste NameMB-TeC 5000 Paste
Automationfully automatic plant
Evaluated ByFOGRA,Smithers Pira
Category PathAssembly & Packaging > Component Placement > Die Bonding & Chip Attachment Systems
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