EVG®301

Overview

EVG301 is a semi-automated single wafer cleaning system that employs one cleaning bowl and uses manual loading and pre-alignment as an R&D-type system for flexible cleaning procedures. The system is available for aqueous based cleaning applications and for solvent based cleaning applications, and offers high-efficiency cleaning using 1 MHz megasonic nozzles or area transducers (3 MHz option) with optional brush scrubbing for single-side cleaning. It uses diluted chemicals for wafer cleaning, prevents cross-contamination from back to front side, and provides a fully software-controlled cleaning process with optional pre-bonding station with IR-inspection and tooling for non-SEMI standard substrates. Technical data include wafer diameter (substrate size): 200, 100 - 300 mm; an open chamber with spinner and cleaning arm; chamber made of PP or PFA (option); cleaning media: DI-water (standard), other cleaning media (option); spinner chuck: vacuum chuck (standard) and edge handling chuck (option) made of metal ion free and clean materials; rotation: up to 3000 rpm (in 5 sec). Megasonic nozzle specifications: Frequency: 1 MHz (3 MHz option); Output power: 30 - 60 W; DI-water flow rate: up to 1.5 liter/min; Effective cleaning area: Ø 4.0 mm; Material: PTFE. Megasonic area transducer specifications: Frequency: 1 MHz (3 MHz option); Output power: max. 2.5 W/cm² active areas (max. output 200 W); DI-water flow rate: up to 1.5 liter/min; Effective cleaning area: triangle shape that guarantees radio uniformity on whole wafers per each rotation; Material: SS and sapphire. Brush details: Material: PVA; programmable parameters: brush and wafer speed (rpm); adjustable parameters: brush compression, media dispense. The EVG301 is presented as an R&D-type single wafer cleaning system for flexible cleaning procedures with manual loading and pre-alignment. It is available for aqueous-based cleaning applications such as silicon direct bonding and for solvent-based cleaning applications such as post-debond cleans. The system can be combined with EVG wafer alignment and bonding systems to eliminate particles prior to wafer bonding and can be combined with EVG debonding systems to remove the temporary bonding adhesive after debond.