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INFINITE
ASMPT Limited (ASMPT)
Categories:
Die Bonding & Chip Attachment Systems
Model Overview
INFINITE is a new generation of 12" automatic die bonder. It features iDispense for epoxy tailing control, iSense for precise level measurement, iTouch for bonding motion control for thin die and special epoxies, iBalance for vibration protection and dispensing and bonding stability, iFlash fast vis...
Technical Specifications
FeaturesiDispense,iSense,iTouch,iBalance,iFlash,iFlat
MAX Die Size12"
Machine Type12" automatic die bonder
Category PathAssembly & Packaging > Component Placement > Die Bonding & Chip Attachment Systems
Uplook Opticsoptional uplook optics
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